2X2G DDR3 1333 KINGS HYPERX BL

CL(IDD) 9 cycles

 

Row Cycle Time (tRCmin) 49.5ns (min.)

 

Refresh to Active/Refresh 110ns

 

Command Time (tRFCmin)

 

Row Active Time (tRASmin) 36ns (min.)

 

Power 1.800 W (operating per module)

 

UL Rating 94 V - 0

 

Operating Temperature 0° C to 85° C

 

Storage Temperature -55° C to +100° C

 

Kingston’s KHX1333C9D3B1K2/4G is a kit of two 256M x 64-bit (2GB) DDR3-1333MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240- pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

 

JEDEC standard 1.5V ± 0.075V Power Supply

 

VDDQ = 1.5V ± 0.075V

 

667MHz fCK for 1333Mb/sec/pin

 

8 independent internal bank

 

Programmable CAS Latency

5,6,7,8,9,10

Posted CAS

 

Programmable Additive Latency

0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

 

8-bit pre-fetch

 

Burst Length

8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does

 

not allow seamless read or write [either on the fly using A12

 

or MRS]

 

Bi-directional Differential Data Strobe

 

Internal(self) calibration

Internal self calibration through ZQ

pin (RZQ

240 ohm ± 1%)

On Die Termination using ODT pin

 

Average Refresh Period 7.8us at lower than TCASE 85°C,

 

3.9us at 85°C < TCASE ≤ 95°C

 

Asynchronous Reset

 

PCB

Height 1.180” (30.00mm), double sided component

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