2X4GB DDR3 1600 KINGST XMP BLU

Kingston s KHX1600C9D3K2/8GX is a kit of two 512M x 64-bit

 

(4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8

 

memory modules, based on sixteen 256M x 8-bit DDR3 FBGA

 

components per module. Each module kit supports Intel ® XMP

 

(Extreme Memory Profiles). Total kit capacity is 8GB. Each

 

module kit has been tested to run at DDR3-1600 at a low

 

latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed

 

to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.

 

Each 240-pin DIMM uses gold contact fingers and requires

 

+1.5V. The JEDEC standard electrical and mechanical specifi-

 

cations are as follows:

 

JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

 

VDDQ = 1.5V (1.425V ~ 1.575V)

 

667MHz fCK for 1333Mb/sec/pin

 

8 independent internal bank

 

Programmable CAS Latency

9, 8, 7, 6

Posted CAS

 

Programmable Additive Latency

0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

 

8-bit pre-fetch

 

Burst Length

8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

 

allow seamless read or write [either on the fly using A12 or

 

MRS]

 

Internal(self) calibration

Internal self calibration through ZQ

pin (RZQ

240 ohm ± 1%)

Average Refresh Period 7.8us at lower than TCASE 85°C,

 

3.9us at 85°C < TCASE < 95°C

 

PCB

Height 1.180” (30.00mm), double sided component

SPECIFICATIONS

 

CL(IDD)

 

9 cycles

 

Row Cycle Time (tRCmin) 49.5ns (min.)

 

Refresh to Active/Refresh 160ns (min.)

 

Command Time (tRFCmin)

 

Row Active Time (tRASmin) 36ns (min.)

 

Power (Operating) 1.410 W

 

(per module)

 

UL Rating 94 V - 0

 

Operating Temperature 0o C to 85o C

 

Storage Temperature -55o C to +100o C

 

Power will vary depending on the SDRAM used.

 

Последно добавени продукти в категорията: