2X4GB DDR3 1600 KINGST XMP BLU

Kingston s KHX1600C9D3K2/8GX is a kit of two 512M x 64-bit
(4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8
memory modules, based on sixteen 256M x 8-bit DDR3 FBGA
components per module. Each module kit supports Intel ® XMP
(Extreme Memory Profiles). Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed
to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:

JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
PCB : Height 1.180” (30.00mm), double sided component


SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 1.410 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.