G3450 3.4GHZ/3M/BOX/1150

Processor Number G3450
Intel® Smart Cache 3 MB
DMI2 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Thermal Solution Specification PCG 2013C
-Performance
# of Cores 2
# of Threads 2
Processor Base Frequency 3.4 GHz
TDP 53 W
-Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
Max # of Memory Channels 2
Max Memory Bandwidth 25.6 GB/s
ECC Memory Supported ‡ Yes
-Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 1.1 GHz
Graphics Video Max Memory 1.7 GB
Graphics Output eDP/DP/HDMI/DVI/VGA
Max Resolution (HDMI 1.4) 1920x1080@60Hz
Max Resolution (DP) 2560x1600@60Hz
Max Resolution (eDP - Integrated Flat Panel) 2560x1600@60Hz
Max Resolution (VGA) 1920x1200@60Hz
DirectX* Support 11.1
OpenGL* Support 4.0
Intel® Quick Sync Video Yes
Intel® Wireless Display Yes
Intel® Clear Video HD Technology Yes
# of Displays Supported ‡ 3
-Expansion Options
PCI Express Revision Up to 3.0
PCI Express Configurations ‡ Up to 1x16, 2x8, 1x8+2x4
Max # of PCI Express Lanes 16
-Package Specifications
Max CPU Configuration 1
TCASE 72°C
Package Size 37.5mm x 37.5mm
Graphics and IMC Lithography 22 nm
Sockets Supported FCLGA1150
Low Halogen Options Available See MDDS
-Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® vPro Technology ‡ No
Intel® Hyper-Threading Technology ‡ No
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI No
Intel® 64 ‡ Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Thermal Monitoring Technologies Yes
Intel® Stable Image Platform Program (SIPP) No
-Intel® Data Protection Technology
AES New Instructions No
Secure Key Yes
-Intel® Platform Protection Technology
Trusted Execution Technology ‡ No
Execute Disable Bit ‡ Yes