G850 2.9GHZ/3MB/LGA1155/BOX

Microarchitecture Sandy Bridge
Processor core Sandy Bridge
Core stepping Q0 (SR05Q)
Manufacturing process 0.032 micron High-K metal gate process
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size 2 x 256 KB
Level 3 cache size 3 MB shared cache
Physical memory (GB) 32
Multiprocessing Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1
SSE4.2
Extended Memory 64 technology (EM64T)
Execute disable bit
Virtualization technology (VT-x)
Low power features Enhanced SpeedStep technology
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
HD graphics controller

Electrical/Thermal parameters
Maximum operating temperature (°C) 69.1
Thermal Design Power (W) 65