INTEL DH61BEB3 /H61/1155/BULK

Кратко описание:

Intel® Desktop Board DH61BE
- CPUIntel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium®processors in an LGA1155 socket with up to 95 W TDP- ChipsetIntel® H61 Express Chipset consisting of the Intel® H61 Platform Controller Hub (PCH)- Memory2 x 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) socketsSupport for DDR3 1333 MHz and DDR3 1066 MHz DIMMsSupport for 1 Gb, 2 Gb, and 4 Gb memory technologySupport for up to 16 GB of system memory with two DIMMs using 4 Gb memory technologySupport for non-ECC memory- VGAIntegrated graphics support for processors with Intel® Graphics Technology: ― VGA― DVI-DDiscrete graphics support for PCI Express 2.0 x16 add-in graphics card- Expansion Slots1 x PCI Express 2.0 x16 add-in card connector2 x PCI Express 2.0 x1 add-in card connectors1 x Conventional PCI bus connector- ConnectorsChassis intrusion headerS/PDIF headerFront panel USB 2.0 header12 V internal power connector (ATX12V)Rear chassis fan headerProcessor fan headerFront chassis fan headerLow Pin Count (LPC) Debug headerTrusted Platform Module (TPM) headerMain power connector (2 x 12)SATA connectors (two 6 Gb/s SATA ports (blue) and four 3 Gb/s SATA ports (black))Front panel headerAlternate front panel power LED headerIntel® Management Engine BIOS Extension (Intel® MEBX) Reset headerSerial port header3 x Front panel USB 2.0 headersInternal mono speaker headerFront panel audio header- StorageSix SATA interfaces through the Intel H61 Express Chipset with Intel® RapidStorage Technology RAID support:― Two internal SATA 6 Gb/s ports (blue)― Four internal SATA 3 Gb/s ports (black)- AudioIntel® High Definition Audio:― Realtek ALC892 audio codec― S/PDIF audio header― Front panel audio header― Mono speaker header- LANGigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579V Gigabit Ethernet Controller- Rear Panel I/O PortsPS/2 keyboard/mouse connector2 x USB 2.0 portsVGA connectorParallel portDVI-D connectorLAN2 x USB 3.0 portsRear surroundCenter channel and LFE (subwoofer)S/PDIF out (optical)Line inLine out/front speakersMic in/side surround- BIOSIntel® BIOS resident in the SPI Flash deviceSupport for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS- Form FactorMicroATX- Dimensions243.84 mm x 198.12 mm- PackageBulk

INTEL DH61BEB3 /H61/1155/BULK

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