INTEL DH61BEB3 /H61/1155/BULK

- CPU
Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium®
processors in an LGA1155 socket with up to 95 W TDP

- Chipset
Intel® H61 Express Chipset consisting of the Intel® H61 Platform Controller Hub (PCH)

- Memory
2 x 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology
Support for non-ECC memory

- VGA
Integrated graphics support for processors with Intel® Graphics Technology:
― VGA
― DVI-D
Discrete graphics support for PCI Express 2.0 x16 add-in graphics card

- Expansion Slots
1 x PCI Express 2.0 x16 add-in card connector
2 x PCI Express 2.0 x1 add-in card connectors
1 x Conventional PCI bus connector

- Connectors
Chassis intrusion header
S/PDIF header
Front panel USB 2.0 header
12 V internal power connector (ATX12V)
Rear chassis fan header
Processor fan header
Front chassis fan header
Low Pin Count (LPC) Debug header
Trusted Platform Module (TPM) header
Main power connector (2 x 12)
SATA connectors (two 6 Gb/s SATA ports (blue) and four 3 Gb/s SATA ports (black))
Front panel header
Alternate front panel power LED header
Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header
Serial port header
3 x Front panel USB 2.0 headers
Internal mono speaker header
Front panel audio header

- Storage
Six SATA interfaces through the Intel H61 Express Chipset with Intel® Rapid
Storage Technology RAID support:
― Two internal SATA 6 Gb/s ports (blue)
― Four internal SATA 3 Gb/s ports (black)

- Audio
Intel® High Definition Audio:
― Realtek ALC892 audio codec
― S/PDIF audio header
― Front panel audio header
― Mono speaker header

- LAN
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579V Gigabit Ethernet Controller

- Rear Panel I/O Ports
PS/2 keyboard/mouse connector
2 x USB 2.0 ports
VGA connector
Parallel port
DVI-D connector
LAN
2 x USB 3.0 ports
Rear surround
Center channel and LFE (subwoofer)
S/PDIF out (optical)
Line in
Line out/front speakers
Mic in/side surround

- BIOS
Intel® BIOS resident in the SPI Flash device
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

- Form Factor
MicroATX

- Dimensions
243.84 mm x 198.12 mm

- Package
Bulk