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INTEL DP67BGB3 /P67/BOX
INTEL DP67BGB3 /P67/BOX(голяма снимка)
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към страницата на INTEL DP67BGB3 /P67/BOX
Описание на INTEL DP67BGB3 /P67/BOX:- Intel® Desktop Board DP67BG
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- - CPUIntel® Core™ i7, Intel® Core™ i5, and Intel® Core™ i3 processors with up to 95 W TDP in an LGA1155 socket- ChipsetIntel® P67 Express Chipset consisting of the Intel® P67 Platform Controller Hub (PCH)- Memory4 x 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) socketsSupport for DDR3 +1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMsSupport for 1 Gb, 2 Gb, and 4 Gb memory technologySupport for up to 32 GB of system memory with four DIMMs using 4 Gb memory technologySupport for non-ECC memorySupport for 1.35 V low voltage JEDEC memorySupport for XMP memory- VGA-- Expansion Slots2 x PCI Express 2.0 x163 x PCI Express x1 bus add-in card connectors from the PCH2 x Conventional PCI bus add-in card connectors from the PCH via PCI bridge- ConnectorsFront panel audio headerRear chassis fan header12 V processor core voltage connector (2 x 4 pin)Processor fan headerAlternate front panel power LED headerMain power connector (2 x 12 pin)Onboard power buttonOnboard reset buttonFront chassis fan header6 x SATA connectors (6)Consumer IR transmitter (output) headerConsumer IR receiver (input) header3 x Front panel USB 2.0 headers Chassis intrusion headerIEEE 1394a front panel headerFront panel headerS/PDIF out headerAuxiliary fan header- StorageTwo Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel P67 ExpressChipset with Intel® Rapid Storage Technology RAID support (blue)Four internal SATA 3.0 Gb/s interfaces through the Intel P67 Express Chipset with Intel Rapid Storage Technology RAID support (black)One back panel eSATA port (red)- AudioIntel® High Definition Audio subsystem using the Realtek ALC892 audio codec- LANGigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579V Gigabit Ethernet Controller- Rear Panel I/O PortseSATA portIEEE 1394a connector8 x USB 2.0 portsLAN2 x USB 3.0 portsRear surroundS/PDIF out (optical)Center channel and LFE (subwoofer)Line inLine out/front speakersMic in/side surround- BIOSIntel® BIOS resident in the SPI Flash deviceSupport for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS- Form FactorATX- Dimensions304.80 mm x 243.84 mm- PackageBoxwww.intel.com
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- The specification and pictures are subject to change without notice.
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