SM MBD X11SPL-F-O

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
Intel® C621 Chipset
Expansion slots:
2 PCI-E 3.0 x8 (in x16),
4 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 GbE LAN ports
8 SATA3 (6Gbps) ports
I/O: 1 VGA, 2 COM, TPM header
2 SuperDOM with built-in power
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280, 22110
Key: M-Key
Double Height Connector