All DRAM IC are verified by high standard criteria.
High quality 2oz copper 8 layers PCB (Printed Circuit Board):
- Assist spreading of heat from critical areas to perform effective thermal cooling.
- Decrease the resistance of electronic flow to avoid electric waste.
- Increase DRAM module’s lifetime.
- Improve signal integrity.
Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
Thermal Conductive Technology (TCT) - Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
Feature Extreme Memory Profiles.
Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
Optimized for 64-bit OS (operating system).
Test at latency settings 9-9-9-24 at 1.55V-1.75V.
SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
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